磷銅球 P-Copper

磷銅球主要原料是陽極電解銅,磷含量最佳區間在0.04-0.065%,主要使用於印刷電路板導孔電鍍和工業及塑膠電鍍。

尺寸(可客製化尺寸)
塊狀:1" x 1"
球狀:12, 16, 20, 28, 40,45, 50, 55mm
板狀:100mm(寬) x 10mm(厚);
150mm(寬) x 20mm(厚)

包裝(可客製化包裝)
紙箱:20kg, 25kg
棧板:900kg, 1000kg



Phosphor Copper Anode

Phosphor Copper Anode was made from anode copper, the best phosphor content is around 0.04-0.065%, usually used for printed Circuit boards electroplating, industrial and plastic electroplating.

Size(Customized Size available)
Nugget: 1”x1”
Ball: 12,16,20,28,40,45,50,55mm
Plate: 100mm(Width)x10mm(Thickness)
          150mm(Width)x20mm(Thickness)

Packing(Customized Packing available)
Paper Carton: 20kg, 25kg
Pallet: 900kg, 1000kg